[1018] Backgrind / Die Singulation / Pick & Place Principal Engineer

2018-06-29 18:14:59

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-06-29

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Singapore

Minimum Qualification

Degree

Years of Experience

6

Job Details


Job Description

  • Develop and transfer wafer finishing – Backgrind, Die Singulation, Pick & Place technologies.
  • Drive process development, inclusive of process/product characterization, qualification and production pilot runs and volume ramp.
  • Introduce new products, processes and technologies within customer requirements.
  • Perform routine reporting of project status and updating of process documentations, yield analysis, and lead troubleshooting activities.

Job Requirements

  • Bachelor / Masters / PhD in Electrical & Electronics/ Mechanical / Chemical/ Material Engineering, Chemistry, Physics, or any related discipline.
  • 6 years of semiconductor experience in Backgrind, Die Singulation, and/or Pick & Place processes.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.