[1064] Senior Process (Flip Chip) Engineering Manager

2018-08-20 11:00:04

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-09-04

Industry

Semiconductor

Job Category

Engineering

Status

UPCOMING

Location

Malaysia

Minimum Qualification

Bachelor

Years of Experience

10

Job Details


Job Description

  • Flip Chip Process DevelopmentĀ 
  • Flip Chip Integration Development
  • Flip Chip Technology (Equipment/Process/Metrology) pathfinding
  • Plans and conducts experiments to fully characterize process throughout pathfinding to development to ramp
  • Transfer process to high volume manufacturing and provide support in new factory start-up

Job Requirements

  • Min. Bachelor degree in Engineering/Science with at least 10 years of relevant experience
  • Strong experience in semiconductor assembly process characterization and process capability
  • Proficient in statistical analysis and familiar in using Excel and JMP
  • Expert in DOE design and execution



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.