[1071] Die / Lens Attach R&D Engineer / Senior Engineer

2018-08-30 14:32:24

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-08-30

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Singapore

Minimum Qualification

Bachelor

Years of Experience

2

Job Details


Job Description

  • Die / Lens Attach process development.
  • Design chuck and tooling for new product.
  • Setup and optimize the needle and jetter dispensing system
  • Quality new epoxy material.
  • Review product design and process capability to meet customers’ requirements.

Job Requirements

  • Bachelor in Electronics / Electrical / Mechanical Engineering, Physics or related disciple.
  • 2 years of Die / Lens Attach semiconductor experience.
  • Experience in SPC, FMEA, MSA, OCAP, JMP / Minitab.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.