[1112] Packaging Engineer / Senior / Principal

2018-10-17 16:31:31

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-10-17

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Singapore

Minimum Qualification

Degree

Years of Experience

2

Job Details


Job Description

  • Principal focus in technology transfer / NPI and drive product and process characterization.
  • Ensure timely delivery of quality innovations and products to meet market and customer demands.
  • Establish good process margins and inline controls, and perform routine reporting of project status and creating/updating of process documents.
  • Yield analysis and lead troubleshooting of issues and process excursions.

Job Requirements

  • Degree / Master / PhD in E&E / Mechanical / Chemical Engineering, Physics, Chemistry or relevant disciple.
  • 4 years of semiconductor experience, with prior experience in 2.5D/3D advanced wafer level packaging processes / flip chip bumping.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.