[1115] Senior Failure Analysis Engineer

2018-10-23 17:06:57

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-10-23

Industry

Semiconductor

Job Category

Engineering

Status

UPCOMING

Location

Penang

Minimum Qualification

Bachelor

Years of Experience

5

Job Details


Job Description

  • Able to lead in solving package, drive, and device level analysis for new product qualification, assembly and test failure from production and customer return.
  • Define Failure Analysis flow for each case, and generate report to assist on root-cause finding.
  • Subject matter expert on TEM equipment.
  • Initiate key technical project and aware of technical advance within are of specialization.

Job Requirements

  • Bachelor/Master in Electrical/Electronic/Materials/Chemistry with at least 5 years of experience in Failure Analysis (in SMT, package, and device)
  • Familiar with semiconductor wafer fab and SMT assembly process and technology
  • Strong technical knowledge on 3D X-ray, TDR, FIB, TEM, SEM/EDX, OBIRCH, EMMI, Thermal imaging, curve tracer analysis and CSAM.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.