[1140] Equipment Engineering Manager

2018-11-21 16:46:07

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-11-21

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Malaysia

Minimum Qualification

Degree

Years of Experience

6

Job Details


Job Description

  • Lead the Wafer Thinning / Dicing Equipment section.
  • Implement preventive / predictive maintenance and productivity improvement program,
  • Driving Key Performance Indices (KPIs) through continuous improvement projects and cost reduction efforts.
  • Define equipment capabilities, strategies and roadmap.
  • Work with respective teams and suppliers on new products.

Job Requirements

  • Bachelor / Master in Mechanical, Mechatronics, Electrical, Electronics Engineering or related disciple.
  • 6 years of relevant semiconductor experience.
  • Knowledge in Wafer Thinning, Dicing / Laser Grooving.
  • Experience in FMEA, DOE, KT and Data Analysis.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.