[1141] Process Engineering Manager

2018-11-21 17:00:03

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-11-21

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Malaysia

Minimum Qualification

Degree

Years of Experience

6

Job Details


Job Description

  • Implement process and equipment modifications to improve production efficiencies, yield and SPC.
  • Role model and lead the team in driving structured and consistent problem solving methodology.
  • Lead engineering improvement activities for the factory.
  • Drive and influence BU and stakeholders in making right decision for the factory without impacting factory operations.

Job Requirements

  • Bachelor / Master in Mechanical, Mechatronics, Electrical, Electronics Engineering or related disciple.
  • 6 years of relevant semiconductor process experience.
  • Knowledge in Die Attach / Wire Bond / Wafer Thinning / Wafer Dicing / Molding / Solderball Mount / Laser Mark / Singulation.
  • Experience in FMEA, SPC, DOE, KT, Material Properties / Package Analysis.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.