[1146] Equipment Engineer

2018-11-29 14:18:34

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2018-11-29

Industry

Semiconductors

Job Category

Equipment Engineer

Status

UPCOMING

Location

Malaysia

Minimum Qualification

Degree

Years of Experience

2

Job Details


Job Description

  • Responsible for the Assembly/Test Equipment engineering PM and day-to-day sustaining.
  • Liaise with NPI, process engineering and equipment vendor on equipment upgrading and qualification.
  • Drive equipment (OEE, MTBA, MTBF, UPH), quality and productivity improvement projects.
  • Prepare equipment specification, equipment qualification & commissioning till release to production.
  • Provide technical training to technicians.

Job Requirements

  • Degree in Engineering.
  • Any of these Assembly/Test Equipment and Tool: Die Prep (Backgrind, Sawing, Taping, Detaping), Wire Bond, Die Attach, Mold, Tester, SMT (Chip Shooter, AOI, Reflow oven, Solder Printer, Flux Cleaner, Conveyor) etc.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.