[1182] Die Attach, Flip Chip Bonding Engineer / Senior / Staff

2019-01-09 09:43:46

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2019-01-09

Industry

Semiconductors

Job Category

Engineering

Status

UPCOMING

Location

Singapore

Minimum Qualification

Degree

Years of Experience

5

Job Details


Job Description

  • Develop and transfer Flip Chip processes.
  • Drive process development, qualification and production pilot runs and volume ramp.
  • Introduce new products, processes and technologies within customer requirements.
  • Establish good process margins and inline controls, perform routine reporting, and create and update process documents.
  • Lead yield analysis and troubleshooting activities associated with new process and tools.

Job Requirements

  • Bachelor / Master / PhD in Electrical / Electronics / Material / Mechanical / Chemical Engineering, Chemistry, Physics and related disciple.
  • 5 years of experience in semiconductor backend manufacturing environment.
  • Experience in die attach, flip-chip bonding with thermal-sonic technique, gold-gold interconnect, underfill, micro bead blasting, overmold, laser lift off, electro chemical etching, and packaging design i.e. metallized ceramic substrate.



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.