[1234] R&D IC Packaging Principal Engineer

2019-04-12 18:02:46

UPCOMING

Click here to apply for position
We invite interested candidates to write-in with CV in MS Word format
to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.

Job Summary


Posting Date

2019-04-13

Industry

Photonics

Job Category

Engineering

Status

UPCOMING

Location

Singapore

Minimum Qualification

Bachelor

Years of Experience

5

Job Details


Job Description

  • To develop Integrated Circuit packaging design and process capabilities
  • Develop products from design, prototyping, to process and product qualification
  • Develop Engineering and Manufacturing Specifications for packaging parts and processes
  • Develop wafer scale flip chip assembly and precision dicing, with internal and outsourced partners & technology tool providers
  • Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time

Job Requirements

  • Bachelor/Master/PhD in Electronics/Physics/Optical/Photonics/Computer Engineering with at least 5 years of working experience in relevant field
  • Experience in new product and process development and qualification
  • Hands-on experience in die-bonder, die-assembly tool, fip-chip bonder, wire bonder, and CAD drawing



DISCLAIMER
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg.
We regret that only shortlisted candidates will be contacted for a discussion.