Events

Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

All the Solutions for Developing Chiplets
Keynote Addresses from Industry Leaders:
Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne
This Year’s Main Topics Include:
AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries

The world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics

The European 5G Conference, now in its 9th year, has an established reputation as Brussels’ leading meeting place for discussion on 5G policy.

The new Commission is coming into office at a pivotal time for 5G and for Europe’s digital future more broadly. Concerns are being raised around the pace of progress towards connectivity targets across the region, whilst at the same time, the promise of 5G Advanced and even 6G are on the horizon, potentially opening new use-cases and an opportunity for operators to see a return on the huge investments that they have made. The event will provide the opportunity to hear from high-level policymakers and industry stakeholders on these issues and other key themes such as cyber security, sustainability, connectivity and more. By looking back at the lessons learnt to date and forward to the path towards 5G Advanced and 6G, the event will provide a comprehensive insight into all the key policy aspects that are shaping the 5G ecosystem in Europe.

The Must Attend Event for Chip, Board, and Systems Design Engineers
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.

With the 6 GHz spectrum increasingly available worldwide, Wi-Fi 7 adoption is set to grow rapidly, spanning a wide range of applications, use cases, and market sectors. However, can it support emerging applications that demand even greater throughput—such as AI/ML, AR/VR/XR, industrial IoT, and robotics? Speed is no longer the primary concern for users; instead, reliability and low latency are top priorities for both enterprises and residential customers. So, how can all end-users benefit from the full capabilities of this technology? How can they ensure quality of service, low latency, high bandwidth, and reduced interference?

Join RCR Wireless News at Wi-Fi Forum 2025 to explore the future of the Wi-Fi 7 market and hear from key industry players on their monetization strategies. Learn about best practices for design and implementation, discover Wi-Fi 7’s capabilities and applications, and see how it complements other wireless technologies, such as 5G.

ISSCC 2025 will be held February 16-20, 2025 at the San Francisco Marriott Marquis and features an exhibition space for companies and research instructions to showcase their work.

Formatting Advanced Packaging for the AI Era
The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package technologies beyond conventional limits. The Wafer-Level Packaging Symposium will bring together the foremost experts in the semiconductor industry to examine all aspects of wafer-level packaging, 3D device packaging, advanced manufacturing, and testing technologies. Positioned at the forefront of packaging technology evolution, this conference offers global attendees the chance to engage with the latest technological and business trends in the heart of Silicon Valley.

This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry.

Attend to hear research, challenges, and breakthroughs as you gather with colleagues in San Jose
Join other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications.